Parameter

Details

CPU

AMD Ryzen™ AI Max+ 395
• 16 cores / 32 threads
• TSMC 4nm FinFET process
• Up to 5.1 GHz (MAX)
• 16 MB L2 Cache / 64 MB L3 Cache
• TDP: runs steadily at 120W (peak up to 140W)

GPU

Radeon 8060S Graphics
• 40-core RDNA 3.5 architecture

AI NPU

Based on XDNA 2 architecture
• 50 TOPS
• Overall processor performance up to 126 TOPS

• LM Studio: AI performance 2.2× higher than NVIDIA RTX 4090 with lower power consumption

Memory (RAM)

Onboard LPDDR5X (non-upgradeable)
• Options: 64GB or 128GB
• Speed: 8000MHz

Primary Storage (ROM)

PCIe 4.0 M.2 2280 SSD
• Capacities: 2TB or 4TB
• Supports PCIe 3.0/4.0 (SATA drives are not supported)

Internal Storage Expansion

Dual M.2 2280 slots
• Maximum total storage: 16TB (each slot supports up to 8TB via PCIe GEN4 x4)

Video Output

Available via HD , DisplayPort, and USB4
• Maximum supported resolution: 7680×4320 @ 60Hz

Network (WiFi & LAN)

WiFi:
• Wifi7: RZ717(MT7925)
Ethernet:
• 1 × RJ45 Gigabit LAN (2.5G, 8125BG)

Bluetooth

Bluetooth 5.4

Power – Charger

DC 19.5V, 11.8A (~230.1W)
• AC Input: 100–240V, 50/60Hz, 4.0A

Front Panel I/O

• 2 × USB-A 3.2 Gen2
• 1 × Audio Combo (3.5mm jack)
• 1 × USB Type-C (USB4.0)
• 1 × SD Card Reader (SD4.0, supports SDXC)
• Buttons: Power, System Fan Lighting Control, Performance Mode Switch

Rear Panel I/O

• 1 × DisplayPort 1.4 HBR3 (8.1 Gbps)
• 1 × HD  2.1 (FRL at 8 Gbps)
• 1 × USB-A 3.2 Gen2
• 2 × USB-A 2.0
• 1 × USB Type-C (USB4.0)
• 1 × Audio (3.5mm CTIA)
• 1 × DC IN (5525 interface)
• 1 × RJ45 Gigabit LAN (2.5G, 8125BG)

OS

• Window 11 Pro

Chassis / Form Factor

• Dimensions: 193 mm x 185.8 mm x 77 mm
• Chassis finish: B/C-grade metal with CNC sandblasted oxidized finish; A-shell plastic spray coating